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Industries

Industries We Serve

Eight industries with eight different sets of requirements, served from one plant in Shenzhen. What changes between them is not the factory but the questions a buyer asks first — so each page starts there.

Certified to

  • ISO 9001:2015
  • IATF 16949:2016
  • UL No. E354070
  • IPC-6012B & IPC-A-600H

Industries

Technical Specifications

Industries served
Automotive · telecom · consumer · industrial · energy · lighting · medical · security
Scope
Bare board · component sourcing · SMT and DIP assembly · test · cable, harness and box build
Order size
MOQ 1 pc · prototype and pilot lots 1–50 pieces · volume quoted from the data package
Lead time
Fastest 1–3 days · standard 5–8 working days · expedited 2 working days · medium volume 4–10 days
Quality systems
ISO 9001:2015 · IATF 16949:2016 · ISO 13485:2016 · ISO 14001 · ISO 45001 · UL E354070
Engineering review
DFM, DFA and DFT before the quotation is fixed
Confidentiality
NDA on request · factory visits by appointment
Payment
Bank transfer (T/T) · EXW Shenzhen or DDP

Hitech Circuits has manufactured in Shenzhen since 1997 (see about Hitech Circuits), and the eight industries below are served from the same plant rather than from separate lines. What changes between them is not the factory — it is the question a buyer asks first, and therefore what the first conversation is about.

What changes between industries

An automotive programme asks how the part stays identical between the first article and the series order. A medical programme asks what the lot record will contain when an auditor requests it five years later. A lighting programme asks where the junction heat goes. A telecom programme asks whether the impedance will hold on the third batch. None of those are answered by a layer count, which is why the process limits sit on one page — PCB manufacturing capabilities — and the industry pages deal with the question itself.

  • Automotive — change control and traceability between prototype and series, under IATF 16949:2016.
  • Telecommunications — an impedance-controlled stack-up that is reproduced batch after batch.
  • Consumer electronics — miniaturisation and a ramp where a cost-down must remain a documented change.
  • Industrial control — a ten-year service life and boards that can be ordered again years later.
  • Renewable energy — high voltage and high current in one enclosure, supported across a fielded fleet.
  • LED lighting — heat leaves through the board, so the substrate decides the product.
  • Medical equipment — documentation and written change confirmation, under ISO 13485:2016.
  • Security systems — radio, imaging and power in a sealed housing with nobody to service it.

One plant from bare board to box

Fabrication and assembly share a site, so impedance-controlled fabrication, component sourcing, assembly, cable and harness work and box build happen without a handover where responsibility changes hands. A single lot record covers the whole build, and a design change does not have to be re-explained to a second supplier.

Starting a programme

A programme usually begins with a prototype lot of one to fifty pieces on the production lines, with the production inspection. MOQ is 1 pc, so a new design can be proven before a volume commitment; once the first article is approved, the same stack-up, finish and placement programme carry into the series order, and the volume price is quoted from the data package rather than from a list.

The quality system behind these pages

Every industry is served by one quality system, with the certificate the end market calls for layered on top: ISO 9001:2015 as the base, IATF 16949:2016 for automotive, ISO 13485:2016 for medical devices, ISO 14001 and ISO 45001 for environment and safety, UL recognition under file E354070, RoHS compliance, and fabrication to IPC-6012B and IPC-A-600H. The scans are published on the certifications page, and the inspection sequence is on quality assurance.

Where to start

Read the page for the industry the product is sold into, then send a Gerber set or a BOM — or both — with the quantity and target date. DFM, DFA and DFT reviews happen before quoting, so a stack-up or panelisation problem surfaces while it is still cheap to fix, and a quote can be requested on the contact page if the industry is not listed.

Frequently Asked Questions

  • Which industries does Hitech Circuits build PCBs for?

    Automotive, telecommunications, consumer electronics, industrial control, renewable energy, LED lighting, medical equipment and security systems. All eight are served from the same Shenzhen and Meizhou plants, so an industry programme does not move supplier between the prototype and the series order.

  • What stays in-house across these industry programmes?

    PCB fabrication, component sourcing, SMT and through-hole assembly, cable and harness work, testing and box build all run in one plant. A board does not travel between suppliers between bare-board finish and assembled unit, which keeps one traceable lot record per order.

  • Which quality standards cover the industry work?

    ISO 9001:2015 is the base system, IATF 16949:2016 covers automotive programmes and ISO 13485:2016 covers medical devices; ISO 14001 and ISO 45001 sit alongside them. Boards are UL recognised under file E354070, RoHS compliant, and fabricated to IPC-6012B and IPC-A-600H.

  • What order size and lead time should a programme plan for?

    MOQ is 1 pc, so a programme can start with a single board; prototype lots of 1 to 50 pieces run on the production lines. Prototypes come back in 1 to 3 days at the fastest, 5 to 8 working days on the standard queue, 2 working days expedited at a premium, and medium volume in 4 to 10 days.

  • Can drawings be shared before a purchase order exists?

    Yes. A mutual NDA can be signed before the Gerber set and BOM are exchanged, and the Shenzhen and Meizhou plants are open to customer visits by appointment. Payment is by bank transfer (T/T), with goods quoted EXW Shenzhen or DDP.

Request a customer quote

Free engineering review and quote for PCB manufacturing, PCB assembly, component sourcing and box build.