Printed circuit board manufacturing is the core of the business. Three lines of work run under one roof: quick-turn prototypes, small and medium-volume rigid boards, and flexible printed circuit and assembly services. High-multilayer, high-density interconnect, flexible, rigid-flex, heavy-copper, Rogers and ceramic designs are all built in-house.
Component sourcing, PCB fabrication and assembly run as a single service, so a customer can hand over a bare-board design, a BOM, or a complete product and have the rest handled in the same facility.
Turnkey and partial turnkey
In a full turnkey build Hitech Circuits handles the entire chain — PCB fabrication, component procurement, order tracking, quality monitoring and final board assembly. In a partial turnkey build the customer supplies the PCBs and certain components, and the remaining parts are handled here.
How the two plants are organised
The work is split across two sites. The Shenzhen plant (4,000 m²) concentrates on quick-turn prototypes, small and medium-volume boards, HDI and specialty materials. The Meizhou plant (30,000 m²) carries volume rigid production.
Product mix
- Rigid PCB (1–38 layers): 45 %
- HDI PCB (4–16 layers): 18 %
- Aluminium and ceramic PCB (1–4 layers): 18 %
- Flexible and rigid-flex PCB (2–16 layers): 15 %
- Assembly, component sourcing and high-frequency materials: 2 %
Markets served
- Europe: 40 %
- China: 25 %
- North America: 20 %
- Australia and Asia-Pacific: 15 %
Process limits for each board type are listed on the PCB manufacturing capabilities page, and the issued certificates are on the certifications page.