Rigid PCB capability
Rigid boards are fabricated from 1 to 38 layers on the same floor as the flex, metal-core and ceramic lines. High-frequency, high-Tg and halogen-free laminates are held in stock so impedance-controlled and high-reliability designs stay inside one build.
- Layer count: 1–38 layers
- Maximum size: 580 × 1900 mm
- Material: CEM1, FR-1, FR-4, high-Tg FR-4, halogen-free, high-frequency (Rogers, Arlon, Taconic, Nelco…), aluminium base, copper base
- Board outline tolerance: ±0.10 mm
- Board thickness: 0.1–6.0 mm
- Thickness tolerance: ±8 % (t ≥ 0.8 mm) · ±10 % (t < 0.8 mm)
- Outer layer copper thickness: 0.5–20 oz
- Inner layer copper thickness: 0.5–10 oz
- Minimum line / space: 0.075 mm
- Minimum finished hole: 0.15 mm (mechanical) · 0.1 mm (laser)
- Aspect ratio: 15:1
- Impedance control tolerance: ±10 %
- Bow and twist: max. 0.7 %
- HDI stack-up: 1+N+1, 2+N+2, 1+1+N+1+1, 3+N+3
- Surface treatment: HASL, lead-free HASL, ENIG, immersion silver, immersion tin, flash gold, golden finger, OSP, carbon ink, peelable mask
- Microvia and ELIC technology
Flexible PCB capability
Flexible and rigid-flex boards are produced up to 12 layers for designs that need to fold, bend or move. Line width and spacing can be taken down to 3 mil, and rigid-flex builds can combine HDI and impedance control.
- Layer count: 1–12 layers
- Base material: Kapton, PI, PET (flex) · FR-4 (rigid)
- Base material thickness: 12.5–50 µm (flex) · 0.1–3.2 mm (rigid)
- Copper thickness: 0.5–2 oz
- Protective film thickness: 12–25 µm
- Adhesive thickness: 12–35 µm
- Reinforcement: PI, PET, FR-4, stainless steel
- Maximum board size: 9.842″ × 19.685″
- Minimum line / space: 0.002″
- Minimum hole: 0.006″
- Surface treatment: ENIG, immersion tin, OSP, carbon ink
Metal-core PCB capability
Metal-core boards are built on aluminium or copper bases for LED lighting, power conversion and other high-thermal designs. Layer count stays low because the metal base carries the heat rather than extra copper.
- Layers: 1–4
- Metal core type: standard aluminium PCB, COB MCPCB, copper base board
- Maximum dimension: 1900 × 480 mm
- Minimum dimension: 5 × 5 mm
- Minimum trace / line spacing: 0.1 mm
- Warp and twist: < 0.5 mm
- Finished thickness: 0.2–4.5 mm
- Copper thickness: 18–240 µm
- Hole inner copper thickness: 18–40 µm
- Hole position tolerance: ±0.075 mm
- Minimum punching hole diameter: 1.0 mm
- Minimum punching square slot: 0.8 × 0.8 mm
- Silk print circuit tolerance: ±0.075 mm
- Outline tolerance: CNC ±0.1 mm · mould ±0.75 mm
- Minimum hole size: 0.2 mm (no maximum limit)
- V-cut angle deviation: ±0.5°
- V-cut board thickness range: 0.6–3.2 mm
- Minimum component mark character: 0.15 mm
- Minimum open window for pads: 0.01 mm
- Solder mask: green, white, blue, matte black, red
- Surface finishing: HASL, lead-free HASL, immersion gold, OSP
Ceramic PCB capability
Ceramic substrates carry the high insulation, high frequency and high-temperature designs that FR-4 cannot survive. Hitech Circuits works with 96 % and 98 % alumina (Al₂O₃), aluminium nitride (AlN) and beryllium oxide (BeO), in thin-film, thick-film and direct copper bonded (DCB) processes.
Alumina (Al₂O₃) sizes
Thicknesses above 2.0 mm are custom-built; the regular stock sizes are:
| Thickness | Size |
|---|---|
| 0.25 mm | 114 × 114 mm |
| 0.38 mm | 130 × 140 mm |
| 0.5 mm | 130 × 140 mm |
| 0.635 mm | 130 × 140 mm |
| 0.8 mm | 130 × 109 mm |
| 1.0 mm | 130 × 140 mm |
| 1.2 mm | 130 × 109 mm |
| 1.5 mm | 127 × 127 mm |
| 2.0 mm | 130 × 140 mm |
Other sizes are customised; the largest alumina panel produced is 300 × 300 mm.
Aluminium nitride (AlN) sizes
Thicknesses above 1.0 mm are custom-built; the regular stock sizes are:
| Thickness | Size |
|---|---|
| 0.25 mm | 50.8 × 50.8 mm |
| 0.38 mm | 114 × 114 mm |
| 0.5 mm | 114 × 114 mm |
| 0.635 mm | 114 × 114 mm |
| 1.0 mm | 300 × 300 mm |
Ceramic properties
- Thermal conductivity: Al₂O₃ 20–51 W/m·K · AlN 120–220 W/m·K
- Finished copper thickness: 18 / 35 / 70 µm
- Hole size: 0.075–30 mm
- Surface finish: RoHS immersion silver, ENIG, ENEPIG
- Conductor: copper (Cu)
- Minimum line width / spacing: 50 µm / 50 µm on inner and outer layers (base copper below 10 µm)
- Maximum board dimension: 300 × 300 mm per piece
- Conductor material: silver palladium (AgPd) or gold palladium (AuPd) for thin- and thick-film; copper only for DCB
- Application temperature: −55 to 850 °C
- Maximum compression strength: > 7,000 N/cm²
- Breakdown voltage: 15 / 20 / 28 kV/mm at 0.25 / 0.63 / 1.0 mm respectively
- Thermal expansion coefficient: 7.4 ppm/K (50–200 °C)
PCBA capability
Assembly runs alongside fabrication, so a board does not leave the site between bare-board finish and assembled unit:
- SMT capacity: four lines, six million chips per day (0402 and 0201)
- DIP capacity: three lines, 1.6 million pieces per day
- Fine-pitch assembly: down to 01005 and 0201 packages
- Placement accuracy: down to 4 mil (0.1 mm) pitch
- Placement: single- or double-sided
- Additional processes: cable and harness assembly, box build assembly
- Engineering support: DFM, DFA and DFT review
- Rework and inspection: BGA rework, re-balling, X-ray
- Stencils: cut and delivered within four hours
Where fabrication, component sourcing and assembly are bought as one China order, the China PCB assembly page explains how the stages are quoted and traced together.
Lead time
- Prototype: 1–3 days (fastest)
- Standard queue: 5–8 working days for 2–8 layers
- Expedited: 2 working days at a premium, and 24 hours on 2-layer panels where capacity allows
- Medium volume: 4–10 days
- Mass production: depends on the BOM
The fastest, standard and expedited windows are the three published delivery options; the date is confirmed on the quotation for the actual stack-up, surface finish and quantity.