About the event
NEPCON JAPAN is the electronics R&D, manufacturing and packaging exhibition held at Tokyo Big Sight. The 2026 edition was the 40th, and it draws engineers from automotive, consumer electronics and semiconductor equipment companies alongside component and material suppliers.
For a board supplier, the value is not footfall. It is the density of technical questions: a stack-up that has to survive 150 °C, a ceramic substrate replacing a metal core, a rigid-flex section that has to fold into a housing.
What we showed
- Heavy copper — 0.5–20 oz outer, 0.5–10 oz inner, for converters, motor drives and welding equipment.
- Ceramic — 96 % and 98 % alumina, aluminium nitride and DCB, for high-temperature and RF work.
- Rigid-flex and flex — up to 12 layers on Kapton and polyimide, with PI, PET, FR-4 or stainless-steel stiffeners.
- HDI — 1+N+1 to 3+N+3 and ELIC, with 0.1 mm laser microvias.
- PCBA — assembled boards from the same site, so fabrication and assembly are one conversation.
Follow-up
If you visited the booth, write to sales@hitechcircuits.com with the project details and mention NEPCON JAPAN 2026. Sending the stack-up and the drill table in advance lets the review start before the next call.
The process limits are on the capability page; the board families are described on the PCB manufacturing page, and the assembly side on the PCBA manufacturing page.
