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Hong Kong Electronics Fair, Autumn 2025

A short record of the show: where we were, what we brought and how buyers can continue the conversation.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

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Last updated:

Technical review: Process figures checked against our published capability sheet. View capability sheet

Hitech Circuits at the Hong Kong Electronics Fair (Autumn Edition) 2025, Meet Us at 5B-B20

Why we exhibit

Trade fairs are a chance to put a face to an enquiry and to answer technical questions in person. Most of the conversations that continue afterwards start with a stackup or a BOM on the table.

What we brought

Samples covering rigid, flex and metal-core work, together with capability data: 1–38 layers, 0.075 mm trace and spacing, 0.1 mm laser vias and boards up to 580 × 1900 mm.

Next steps

If you met the team at the show, send the files and the quantity. We will confirm the stackup, the finish and the lead time.

Technical Specifications

Event
Hong Kong Electronics Fair, autumn edition 2025
Booth
5B-B20
Focus
PCB manufacturing, assembly and component sourcing

Frequently Asked Questions

  • What could visitors discuss at the booth?

    Fabrication and assembly projects: layer count and stackup, material and finish, assembly volume and test requirements. Bringing a Gerber set or a BOM made the conversation specific rather than general.

  • How can buyers follow up after the show?

    Send the project details to sales@hitechcircuits.com with the files attached, and mention the booth so the enquiry is matched to the show discussion. A DFM review and quotation follow from there.

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