We joined APEX EXPO 2026 in Anaheim to meet North American buyers and discuss assembly projects in person.
Hitech Circuits Engineering Desk
Shenzhen, China · PCB fabrication and assembly
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Technical review: Process figures checked against our published capability sheet. View capability sheet
APEX EXPO is the IPC-backed electronics manufacturing exhibition in North America. It brings assembly equipment, materials and service providers together in one hall.
Assembly for prototypes and volume, component sourcing and test plans. Most conversations ended with an agreement to send a stackup or a BOM for review.
If you met us in Anaheim, write to sales@hitechcircuits.com with the project details and mention APEX EXPO 2026.
Lead times, test coverage and how a supplier handles a defect found after shipment. Those three questions cover most of the difference between suppliers, and each has a concrete answer if the process and records are in place.
Yes. Send the files and requirements in advance and the engineering review can happen before the meeting, so the discussion at the booth is about the build rather than the introduction.
IndustryPublished Korea Electronics Show 2026Hitech Circuits exhibited at KES 2026 at COEX Hall B, Seoul, 13–16 October, booth B117: PCB, ceramic, aluminium, rigid-flex and assembly.
IndustryPublished Hong Kong Electronics Fair, Autumn 2025Hitech Circuits exhibited at the Hong Kong Electronics Fair autumn edition 2025 in booth 5B-B20. What we showed and how to follow up.
IndustryPublished NEPCON JAPAN 2026, TokyoHitech Circuits exhibited at NEPCON JAPAN 2026 at Tokyo Big Sight, 21–23 January, booth E26-16 in East Hall 6. What we showed and how to follow up.Free engineering review and quote for PCB manufacturing, PCB assembly, component sourcing and box build.