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1 oz vs 2 oz Copper on a PCB

The difference is cross-section, not quality. The useful question is whether the extra weight buys something a wider trace cannot.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

Published:

Last updated:

Technical review: Process figures checked against our published capability sheet. View capability sheet

1 oz vs 2 oz Copper on a PCB

Same trace, twice the copper

One ounce of copper is about 35 µm, two ounces about 70 µm. Doubling the thickness doubles the cross-section of every trace on that layer, so resistance falls by half: a 1 oz trace sits at roughly 0.5 mΩ per square, a 2 oz trace at roughly 0.25 mΩ.

That is the whole electrical argument. Everything else — cost, minimum feature size, etch control, panel flatness — follows from the process needed to produce the thicker layer.

What the resistance buys

Take a 1 A current through a net 100 squares long. At 0.5 mΩ per square the trace dissipates about 0.5 mW per square, 50 mW in total, with a voltage drop of about 49 mV. At 2 oz the same net drops about 25 mV and dissipates 25 mW.

On a 3.3 V rail those numbers decide whether the design has margin. On a 48 V rail the voltage drop matters far less, and the temperature rise — not the drop — becomes the reason to add copper.

Cost and design rules

Copper weight is bought twice: in the foil and in the plating time needed to reach it. Heavier foil also etches differently, so the minimum line and space that a fabricator can hold widens as the weight rises. A board that needs 0.075 mm features and 2 oz everywhere is a harder build than one that keeps the heavy copper in planes and wide pours.

Three practical consequences:

  • Layout first, weight second. Widen the trace to the space available, then choose the copper weight that meets the temperature-rise target.
  • Keep heavy copper where the current is. A mixed stack-up with 2 oz on the power layers and 1 oz on signal layers is cheaper than a uniform 2 oz build and usually just as good.
  • Check the connector, not only the trace. A thick trace feeding a fine-pitch connector moves the bottleneck rather than removing it.

Choosing between them

For most digital and low-power analogue boards, 1 oz is enough and 0.075 mm features are worth more than extra copper. For power supplies, motor stages and battery hardware, 2 oz is the usual starting point, and where the current path cannot be widened, the design moves into the heavy copper range.

If the current and the available width point above 3 oz, the heavy copper PCB page lists the published range (0.5–20 oz outer, 0.5–10 oz inner) and the design guide explains what has to change in the layout before quoting.

Technical Specifications

1 oz copper
about 35 µm · roughly 0.5 mΩ per square
2 oz copper
about 70 µm · roughly 0.25 mΩ per square
Heavy copper threshold
3 oz per layer
Range at Hitech Circuits
0.5–20 oz outer · 0.5–10 oz inner
Ampacity reference
IPC-2152, at a stated temperature rise

Frequently Asked Questions

  • Does 2 oz copper double the current a trace can carry?

    Approximately, at the same width and the same permitted temperature rise: doubling the cross-section halves the resistance, and the extra copper spreads heat better. It is not exactly double, because the thicker conductor also changes how the trace cools — which is why capacity is checked against IPC-2152 at a stated temperature rise rather than a fixed multiplier.

  • When is a wider 1 oz trace better than 2 oz copper?

    When the layout has room. A 1 oz trace twice as wide has the same cross-section as a 2 oz trace at the original width, costs less in foil and plating time, and etches with finer features. Thicker copper pays when width is constrained — fine-pitch escape routing, dense connectors, or a plane that has to stay thin.

  • Where does 2 oz stop being enough?

    When the cross-section the current needs no longer fits the width available. At that point the next step is 3 oz and above, where heavy copper rules apply: the minimum line and space is set by the copper weight, the stack-up gets thicker, and thermal relief and mask openings are adjusted for assembly.

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