Why not cross-section immediately?

A cross-section destroys the board and shows one plane. Non-destructive steps — visual, X-ray, CT and electrical measurement — should come first to locate the site and record the evidence. Cutting too early often removes the very feature that explains the failure.

What does dye-and-pry show that X-ray does not?

It shows whether a solder joint had actually wetted. X-ray reveals voids and geometry; dye penetrates the gap between component and pad, and after prying the stained area shows how much of the joint was bonded.

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PCB Failure Analysis Methods

Failure analysis is destructive by nature, so the order matters: look first, cut last.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

Published: 2018-07-29

Last updated: 2026-10-18

Technical review: Process figures checked against our published capability sheet. View capability sheet

Step 1: describe the symptom

Record when it failed: at test, in the field, after thermal cycling. The symptom narrows the likely mechanism before any tool is used.

Step 2: non-destructive inspection

Visual and microscope, X-ray or CT for hidden joints, electrical measurements to localise the fault.

Step 3: destructive analysis

Cross-section the suspect site, then SEM/EDS if the question is about intermetallic growth, contamination or plating quality. Dye-and-pry answers wetting questions.

Step 4: check the process

Compare the finding with lot records — paste, profile, plating thickness, cleanliness test. A root cause that cannot be tied to a process variable will recur.

Technical Specifications

Non-destructive first: visual, X-ray, CT, electrical characterisation
Destructive later: cross-section, SEM/EDS, dye-and-pry
Acceptance: IPC-6012B / IPC-A-600H for fabrication defects

Frequently Asked Questions

Why not cross-section immediately?
A cross-section destroys the board and shows one plane. Non-destructive steps — visual, X-ray, CT and electrical measurement — should come first to locate the site and record the evidence. Cutting too early often removes the very feature that explains the failure.
What does dye-and-pry show that X-ray does not?
It shows whether a solder joint had actually wetted. X-ray reveals voids and geometry; dye penetrates the gap between component and pad, and after prying the stained area shows how much of the joint was bonded.

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