Menu
Blog

SMT Stencils and Their Types

Paste volume is set by the aperture and the foil thickness. The stencil is the cheapest place to fix a print problem.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

Published:

Last updated:

Technical review: Process figures checked against our published capability sheet. View capability sheet

SMT Stencils and Their Types

Laser-cut stainless

The default: accurate, inexpensive and quick to produce. Apertures are cut directly from the paste layer of the Gerber data.

Electroformed

Grown nickel foil with smooth walls and a tapered aperture, which improves release for very fine pitch and high paste volumes. It costs more and takes longer to order.

Step and micro-step

The foil is etched or milled to different thicknesses across the panel. Useful when component mix demands different paste volumes on one print.

Design inputs

Send the paste layer, the finest pitch and the stencil thickness you expect. If apertures are reduced from the pad (common for thermal pads and BGAs), state the reduction so the printer settings match the file.

Technical Specifications

Typical foil thickness
0.10–0.15 mm; thinner for fine pitch
Aperture rule
area ratio ≥ 0.66 for reliable release
Acceptance
IPC-A-610 workmanship

Frequently Asked Questions

  • When is a step stencil worth the extra cost?

    When one board carries both fine-pitch devices and connectors that need more paste. A stepped foil delivers a thinner deposit in the fine-pitch area and a thicker one at the connector, which avoids a second print pass.

  • What is the area ratio and why does it matter?

    It is the aperture opening area divided by the aperture wall area. Below roughly 0.66, paste tends to stay in the aperture instead of releasing onto the pad, which shows up as missing or insufficient paste on small pads.

← Blog

Related engineering notes

Request a customer quote

Free engineering review and quote for PCB manufacturing, PCB assembly, component sourcing and box build.