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Solder Paste: What to Use for Your Product

Paste is a process material, not a commodity. The alloy, powder size and flux class all change how the stencil prints and how the joint forms.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

Published:

Last updated:

Technical review: Process figures checked against our published capability sheet. View capability sheet

Solder Paste: What to Use for Your Product

Alloy

Lead-free SAC305 is the default for exported products; tin-lead remains in use for legacy or exempt applications. The alloy sets the reflow peak and the joint appearance, so the profile must match it.

Powder size

Finer powder prints through smaller apertures but oxidises faster and is more prone to slump. Match the type to the finest pitch on the board rather than to the average.

Flux class

No-clean is standard; water-soluble is chosen when cleanliness matters, at the cost of a wash and dry step. Whatever the class, the residue must be compatible with the next process — especially conformal coating.

Practical rule

State the finest pitch, the assembly cycles and whether the board will be coated. Those three answers select the paste; the printer settings follow.

Technical Specifications

Common alloys
SAC305 lead-free, Sn63Pb37 for legacy products
Powder size
Type 3 for 0.5 mm pitch, Type 4–5 for fine pitch
Acceptance
IPC-A-610 workmanship

Frequently Asked Questions

  • Which powder size suits a 0.4 mm pitch device?

    Type 4 or finer. Larger powder particles cannot pass through the small stencil apertures reliably, so paste release becomes inconsistent and defects rise. The stencil thickness, aperture design and powder size have to be chosen together.

  • Does flux class matter beyond cleaning?

    Yes. No-clean pastes leave residues that are acceptable for most products but can affect conformal coating adhesion and high-impedance circuits. Water-soluble pastes clean thoroughly but need a wash step and complete drying before coating.

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