Visual and X-ray
SPI checks paste; AOI checks placement and fillets; X-ray checks hidden joints. They catch process faults before power is applied.
In-circuit and flying probe
ICT measures components and nets through a fixture; flying probe visits pads with moving heads. Both find opens, shorts and wrong values.
Functional and burn-in
Functional test runs the board as a product against a specification; burn-in stresses it thermally for a period. These catch design margin and early-life failures.
Building the plan
Start from the failure modes that matter: fine-pitch BGA (X-ray), high-value assemblies (ICT), safety functions (FCT), long-life products (burn-in). Then match the sample rate to the volume.



