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First Article Inspection in PCB Assembly

FAI is the gate between setup and volume. Skip it and every defect is multiplied by the batch size.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

Published:

Last updated:

Technical review: Process figures checked against our published capability sheet. View capability sheet

How much do you know PCB Assembly First Article inspection?

What FAI checks

  • Documentation — BOM revision, assembly drawing, approved deviations.
  • Materials — component values, package and polarity against the BOM.
  • Print — paste volume and alignment from SPI data.
  • Placement — offset and rotation, especially for fine pitch.
  • Solder — fillet shape, wetting and voids (X-ray for hidden joints).
  • Test — ICT, flying probe or functional results against the test plan.

Who signs

The line engineer signs internally; the customer reviews when the build is new, the BOM changed or the product is safety-related. A first article held pending approval should stop the run, not merely be filed.

Record

Keep the report with the lot. If a defect appears later, the FAI is the baseline that shows whether the process changed.

Technical Specifications

Quality gates
IQC · IPQC · QC · QA
Acceptance
IPC-A-610 workmanship
Inspection aids
AOI, X-ray, SPI, microscope

Frequently Asked Questions

  • What should the customer review in an FAI report?

    The BOM revision and component markings, polarity of every polarised part, the measured paste volumes, the first-article photos of key joints and the test results. If the report only shows a photo of the assembled board, it is not an FAI.

  • Does FAI replace in-process inspection?

    No. It confirms that the setup is correct before the run; IPQC then monitors the process while it runs. Both are needed, because a correct setup can drift as paste ages or feeders run low.

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