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Removing Components from a Flexible Circuit

A flex board is thinner, softer and less forgiving. The same rework that works on FR-4 can delaminate a flex tail.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

Published:

Last updated:

Technical review: Process figures checked against our published capability sheet. View capability sheet

How to Remove Electronic Components from a Flexible Circuit Board

Support and heat

Support the whole part of the board you are working on. Use preheat for mass, keep the nozzle local and short, and stay below the coverlay limits.

Flux and cleaning

Use a flux that suits the alloy and clean it off; residue on flex is harder to remove and can affect coverlay adhesion.

Inspect after rework

Check the joint, the coverlay edge and the bend area under magnification. If the flex will be bent in service, a bend test on a sample is a better indicator than a visual check.

Technical Specifications

Flex / rigid-flex layers
up to 12 layers
Rework temperature
below the coverlay and adhesive limits
Acceptance
IPC-A-610 workmanship

Frequently Asked Questions

  • Why does a flex board need lower rework temperature?

    The coverlay and the adhesive that bonds it soften earlier than FR-4 laminate. Excess heat delaminates the coverlay or shifts the conductor, and the damage may only show as a crack after flexing.

  • How should a flex board be supported during rework?

    Fully supported on a flat, heat-resistant surface, with the bend area restrained so it cannot flex while hot. Never hold a flex tail by the bend region with tweezers; the crease becomes a stress riser.

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