The building blocks
- Microvias — laser-drilled, 0.1 mm on our lines, connecting adjacent layers.
- Sequential lamination — the core is laminated first, then the outer layers are added around the microvias.
- Via-in-pad and filled vias — allow components to be placed directly over the via.
- Fine features — 0.075 mm trace and spacing on the outer layers.
How many cycles does the design need?
Start from the pin pitch. A fine-pitch BGA may escape on a single sequential cycle; denser packages need two or three. Each cycle adds lamination, drilling and plating steps, so the goal is the minimum that routes the board, not the smallest via the process can make.
What to send
Provide the stackup intent, the via types and the drill table, plus the impedance requirements if any. We build HDI and conventional multilayer on the same floor, up to 38 layers, with flex and rigid-flex up to 12 layers, so the review can compare both options before tooling.
