Menu
Blog

ESD in PCB Assembly

A discharge too small to feel can degrade a junction. The damage is often latent and shows up as a field failure.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

Published:

Last updated:

Technical review: Process figures checked against our published capability sheet. View capability sheet

Electrostatic Discharge and Its Effect on PCBs- Advanced PCB Assembly-Hitech PCB

What ESD does

A fast current pulse through a semiconductor thin oxide or junction can melt a small volume of silicon. The result is either an immediate open or a weakened part that drifts out of specification later.

Where it enters

  • Receiving and stores, when bags are opened
  • Manual handling of boards and trays
  • Soldering and rework stations
  • Test fixtures and cable handling

Controls

Ground the operator, the bench and the tools; use dissipative packaging; verify wrist straps daily; keep ionisers where insulators cannot be grounded. Document the programme, because a good EPA is a routine, not a purchase.

Technical Specifications

Typical control target
EPA with wrist strap and grounded mats
Sensitive parts
MOS, LEDs, sensors, fine-geometry ICs
Acceptance
IPC-A-610 workmanship

Frequently Asked Questions

  • What is the difference between catastrophic and latent ESD damage?

    Catastrophic damage fails immediately at test; latent damage reduces the part margin and fails months later in the field. Latent failures are the dangerous case because they pass final test and are invisible in inspection.

  • Why do packaging and handling matter as much as the bench?

    Because most discharges happen away from the bench: in stores, during transport or when a board is handed to someone without a ground. Protected packaging, grounded carts and training matter as much as wrist straps at the station.

← Blog

Related engineering notes

Request a customer quote

Free engineering review and quote for PCB manufacturing, PCB assembly, component sourcing and box build.