Base and bonding
The aluminium is cleaned and the thermal prepreg is bonded under heat and pressure. Bond quality decides thermal resistance and long-term reliability more than any later step.
Imaging and etching
A single copper layer is imaged and etched with the same principles as FR-4, but the base is thicker and stiffer, so handling and panel support differ.
Machining
Outlines, slots and cut-outs are milled or punched. Edges are deburred and, where the base is exposed, the mechanical drawing should say so.
