What a metal-core stackup looks like
A typical MCPCB is a single conductive layer on a dielectric layer bonded to an aluminium base. The dielectric is thin — often 0.05–0.2 mm — because its job is to conduct heat while standing off voltage. That thin dielectric is also why metal-core boards are usually single-sided: routing a second signal layer means adding another dielectric and copper, and the thermal benefit per layer drops.
Specify the thermal path, not just the material
- Thermal vias move heat from a pad to the metal base; state their diameter, pitch and whether they are filled.
- Copper thickness on the circuit layer affects spreading; 1–2 oz is common, and heavier copper helps where current density is high.
- Solder mask must be specified for the finish you choose; white mask is common on LED boards but yellows under prolonged high temperature.
Mechanical details that decide yield
Metal boards are machined, not routed like thin FR-4. Specify the outline, V-score or routing tolerances, and whether the aluminium edge will be exposed. Remember that the metal base is conductive: mounting holes need clearance or insulating hardware, and the board edge should be deburred.
What we build
Our plant runs 1–38 layer FR-4 boards up to 580 × 1900 mm and 0.1–6.0 mm thick, with aluminium, ceramic and high-frequency materials available for thermal and RF work. Send the thermal requirement, the LED or power device footprint and the mechanical drawing; we will confirm the stackup and the finish before tooling.
