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FR-4 for PCB Fabrication

The laminate is not a commodity line on a quote. Glass style, resin content and Tg set what the board will do in reflow and how tight the drill and trace rules can be.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

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Technical review: Process figures checked against our published capability sheet. View capability sheet

FR-4 for PCB Fabrication

What FR-4 is

FR-4 is a woven glass fabric impregnated with epoxy resin, laminated under heat and pressure with copper foil on one or both sides. The glass style controls thickness and mechanical stability; the resin content controls flow, dielectric constant and how the laminate behaves when drilled.

Three properties that matter

  • Tg (glass transition temperature) — where the resin softens. Standard grades sit around 130–140 °C, high-Tg grades above 170 °C.
  • CTE (coefficient of thermal expansion) — the z-axis expansion during reflow. Thick boards with many layers accumulate more stress at the plated barrels.
  • Dielectric constant and loss — adequate for most digital designs, but the reason RF work moves to specialised laminates.

What to put in the fabrication note

State the laminate grade or Tg class, the board thickness, the copper weight on each layer and the surface finish. If the design depends on impedance control, add the target impedance and reference layer. With those four items the fabricator can pick a build it can laminate repeatably instead of reverse-engineering the intent.

Where FR-4 stops

When the operating temperature exceeds what the resin tolerates, or when insertion loss at the target frequency dominates the loss budget, FR-4 is the wrong substrate. That is the point to evaluate metal-core, ceramic or high-frequency laminates.

Technical Specifications

Typical Tg range
130–180 °C depending on grade
Board thickness
0.1–6.0 mm
Minimum trace / spacing
0.075 mm / 0.075 mm

Frequently Asked Questions

  • Does FR-4 grade affect the drill and trace limits?

    Yes. Resin content and glass style change how the laminate drills and how much copper the plating bath can throw. When a design calls for 0.075 mm trace and spacing, we confirm the laminate and copper weight together rather than approving the rule in isolation.

  • Is standard Tg FR-4 enough for lead-free assembly?

    For many two- and four-layer boards, yes. For thicker multilayer builds, large copper planes or repeated reflow, a high-Tg grade reduces expansion and z-axis stress during assembly; we recommend it after reviewing the stackup and the reflow profile.

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