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Heavy Copper Tolerances: ±20 % and What Tightening Costs

Plating builds copper up, etching takes it away, and both move the finished dimensions. A heavy layer is quoted with a wider band for that reason.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

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Technical review: Process figures checked against our published capability sheet. View capability sheet

Heavy Copper Tolerances: ±20 % and What Tightening Costs

Two processes, two kinds of error

Heavy copper is built by adding copper and then taking some away. Plating deposits the thickness the current path needs; etching defines the trace. Each step has its own error.

Plating thickness depends on current density, and current density depends on how much copper is being plated at once. A panel with dense power planes and sparse signal areas plates unevenly unless the pattern is balanced or the current is adjusted. Etching then removes copper from the top and from the side, so the finished trace is trapezoidal rather than rectangular and narrower than the artwork.

Neither step is out of control; both are simply less precise at 700 µm than at 35 µm. That is what the ±20 % band describes.

What the band means in micrometres

  • At 3 oz, 105 µm ±20 % leaves a conductor between about 84 µm and 126 µm.
  • At 10 oz, 350 µm ±20 % spans about 280–420 µm.
  • At 20 oz, 700 µm ±20 % spans about 560–840 µm.

On a power plane those differences are irrelevant. On a 0.15 mm gap between two heavy traces they are the difference between a reliable dam and a short.

Where tightening pays — and where it does not

Spend the tolerance where it changes behaviour:

  • Controlled impedance. On layers that need it, impedance is held to ±10 %, and the copper thickness of the reference layer is part of that calculation.
  • Fine-pitch connectors and press-fit holes. Here the copper dimension interacts with a mechanical part, and a wide band turns into assembly rejects.
  • High-current shunts and current sense paths. Resistance is the product, so the cross-section tolerance is effectively an electrical tolerance.

Do not spend it on planes, pours and wide bus traces. A plane at 560 µm does the same job as one at 840 µm, and asking for a tight band on it raises cost without improving the product.

Writing the callout

State the nominal width, the tolerance and the measurement method together. A drawing that says "10 oz, ±20 %" and leaves the measurement undefined invites a dispute at incoming inspection; a drawing that adds "verified on cross-section at the coupon" does not.

Where the design genuinely needs a tighter band, say why — impedance, connector fit, current sense — so the fabricator can choose the cheapest way to reach it. The published range and process limits are on the heavy copper PCB page, and the acceptance criteria on the capability page.

Technical Specifications

Conductor tolerance
±20 % typical on width, spacing and thickness
Tighter tolerance
achievable, quoted per design
At 3 oz
±21 µm on a 105 µm layer
At 20 oz
±140 µm on a 700 µm layer
Bow and twist
maximum 0.7 %

Frequently Asked Questions

  • Why is ±20 % normal on heavy copper?

    Two processes move the geometry. Plating adds thickness at a rate set by current density, which varies with pattern density across the panel; etching removes copper from the top and the side, so thick foil loses more width to undercut. Additive plating is preferred to subtractive etching at high weights but costs more, and neither process holds a 35 µm band on a 700 µm layer.

  • Can the tolerance be tightened below ±20 %?

    Yes — tighter limits are achievable and are quoted per design. They are bought with process time: more plating cycles, multi-pass etching, more cross-sections and slower handling. Ask for the band the design can accept rather than the tightest the plant can measure, because every step tighter is paid for in yield.

  • How is the finished copper measured?

    Cross-section coupons give hole-wall copper, surface copper and the conductor profile; X-ray fluorescence gives a fast thickness reading on the panel. Results are judged against IPC-6012B acceptance, with bow and twist held to 0.7 % and the lot record kept with the shipment.

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