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Pad and Drill Size Design

A drill is not free: too small and the barrel plates poorly, too large and the annular ring disappears.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

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Last updated:

Technical review: Process figures checked against our published capability sheet. View capability sheet

Pad and Drill Size Design

Drill and barrel

The drill sets the barrel diameter; plating thickness is controlled by the process. An aspect ratio beyond the process window produces thin or voided barrels regardless of the drill size.

Pad and ring

The pad must leave an annular ring after drill tolerance. Fine-pitch parts trade ring width for routing space, which is why via-in-pad and laser vias appear.

Practical rules

Keep the aspect ratio inside the fabricator's window, size vias for current and not only for routing, and keep pads on rework-prone parts generous.

Technical Specifications

Laser via
0.1 mm minimum
Board thickness
0.1–6.0 mm
Acceptance
IPC-6012B / IPC-A-600H annular ring rules

Frequently Asked Questions

  • What is aspect ratio and why does it limit drilling?

    It is board thickness divided by hole diameter. As it rises, the plating solution reaches the centre of the hole less easily, so the barrel becomes thin. Deep holes and small drills are therefore quoted together, not independently.

  • How much annular ring should a pad have?

    Enough to survive drilling tolerance and rework. IPC sets minimums by class, but thin rings are the first thing to break when a part is desoldered, so most designs use more than the minimum on parts that will be reworked.

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