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Measuring Solder Mask Thickness

Solder mask thickness is not one number. It varies over traces, over bare laminate and at the mask dam between pads.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

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Technical review: Process figures checked against our published capability sheet. View capability sheet

Measuring Solder Mask Thickness

What the number means

Liquid photoimageable mask is printed or sprayed, imaged and cured. Over a trace it builds to roughly 15–25 µm; over bare laminate it is thinner. A drawing that states a single thickness is therefore a simplification.

How it is measured

  • Cross-section — the reference method: measure over traces, between pads and over laminate.
  • Optical / eddy current — fast, non-destructive, used for process control after correlation.
  • Tape and peel tests — adhesion and cure, not thickness.

Process levers

Screen mesh, ink viscosity, print speed and cure profile all move the result. When a design has a tight mask dam between fine-pitch pads, the print parameters are set for that geometry rather than for the panel average.

If mask thickness is a functional requirement — high-voltage isolation, for example — specify the minimum over copper and the measurement method, and we will report it with the lot.

Technical Specifications

Typical mask thickness
15–25 µm over copper, thinner over laminate
Acceptance
IPC-6012B / IPC-A-600H
Minimum trace / spacing
0.075 mm / 0.075 mm

Frequently Asked Questions

  • Why is mask thickness measured over copper rather than over bare laminate?

    Because that is where it matters for dielectric strength and where the mask is thickest. Over bare laminate the coating is much thinner, so a single measurement over laminate would not represent the board. Report both if the specification is strict.

  • Which method should be used?

    Cross-sectioning is the reference method and shows the profile over traces and between them. Non-contact optical or eddy-current gauges are faster for process control but need correlation against cross-sections for the specific ink and cure.

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