What it does
Peelable solder mask is a temporary polymer printed or dispensed over areas that must stay free of solder or conformal coating: connector contacts, press-fit holes, test pads, edge fingers.
Application and removal
It is applied after reflow masking decisions are made, cured, and then peeled after soldering or coating. Removal should be a single continuous pull; if the film tears, the cure or the process temperature is wrong.
Where it fails
- Under-cured film — smears and leaves residue in holes.
- Over-cured film — brittle, tears at edges and takes mask with it.
- Sharp geometry — thin webs between pads tear during peel.
Practical rule
Decide the masking method when the assembly process is defined, not on the line. If the design has fine-pitch connectors, tell us in the fabrication note so the mask opening matches the peelable stencil.
