Where the time goes
A multilayer board passes through inner-layer imaging and etching, lamination, drilling, plating, outer-layer imaging, solder mask, finish and test. Lamination and drilling dominate; every extra lamination cycle adds a full day or more.
What fits a three-day window
- Four to six layers, one lamination cycle.
- Standard FR-4, 1 oz outer copper, HASL or lead-free HASL.
- Minimum trace 0.075 mm and no laser vias.
- Electrical test plus visual inspection.
What moves the board out of it
Eight layers and above, sequential lamination for HDI, heavy copper beyond the standard range, impedance coupons with a tight tolerance, and ceramic or high-frequency substrates all add steps. They are still buildable quickly, but the quotation should carry a realistic date rather than a generic "24 hours".
Our standard windows are 1–3 days for prototypes and 4–10 days for mid-volume, with 1–38 layers and boards up to 580 × 1900 mm. If the schedule is tight, send the stackup with the enquiry — the date depends on the build, not only on quantity.
