The four properties that decide
- Dk (dielectric constant) — sets trace width for a target impedance; stability over frequency and temperature matters as much as the nominal value.
- Df (dissipation factor) — the loss per unit length; the dominant term in insertion loss at high frequency.
- CTE — expansion mismatch with copper and with plated holes; affects reliability of vias in thick builds.
- Copper roughness — contributes loss as frequency rises.
What to send us
For RF work we need the target impedance and reference layer, the operating frequency band, the stackup or board thickness, and the finish. With those we confirm the laminate, the trace geometry and whether the build needs low-profile copper.
Our lines hold 0.075 mm trace and spacing, 0.1 mm laser vias and impedance tolerances of ±10% as standard, with ±5% quoted after reviewing the stackup.
