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Above 20 oz: What Changes on Ultra-Heavy Copper

The published limit at this plant is 20 oz on outer layers and 10 oz inside. Requests above it are not impossible; they are a different build.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

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Technical review: Process figures checked against our published capability sheet. View capability sheet

Above 20 oz: What Changes on Ultra-Heavy Copper

The limit, stated plainly

Heavy copper at Hitech Circuits runs from 0.5 oz to 20 oz on outer layers and 0.5 oz to 10 oz on inner layers, on boards 1–38 layers and 0.1–6.0 mm thick. Twenty ounces is about 700 µm per side.

Above that, the process does not simply take longer. It changes at several steps at once, and each change costs yield.

What changes above it

StepWhat changes
Prepreg and laminationResin-rich grades fill a deeper copper step; extra lamination cycles may be required
DrillingMore bit wear and firmer stack support; hole position and aspect ratio stay inside the same limits
PlatingSeveral cycles rather than one pass, each calculated from the racked area
EtchingMulti-pass removal to keep the top and bottom of the trace even
Solder maskTwo prints to cover the step without skips and trapped air
Handling and flatnessHeavier panels scratch and bow more easily; bow and twist still held to 0.7 %

The order matters. Lamination and drilling limit the build before the plating bath does, which is why an ultra-heavy request is quoted from the stack-up rather than from a copper weight alone.

Three alternatives worth comparing

Copper inlay. A machined or pressed copper slug set into the laminate carries very high current in a defined area without thickening the whole layer. It is a common answer for battery terminals and high-current pads.

Parallel layers. Two 10 oz layers tied together with a full via field carry the same current as one 20 oz layer in most geometries, and each layer stays inside the standard process.

A busbar. Where the conductor leaves the board, a busbar is cheaper, cooler and mechanically stronger than any laminate. Heavy copper planes feeding a busbar is the usual architecture in converters and traction hardware.

None of these is a workaround for a badly specified design; they are standard ways of moving current that a laminate alone should not carry.

How to quote an above-limit request

Send the current per net, the permitted temperature rise, the run length and the termination — a connector, a stud, a welded tab. With those, the answer is a stack-up, an inlay, a busbar or a combination, and it can be priced honestly.

What does not work is quoting 40 oz as if it were a heavier version of 20 oz. The production impact lands on lamination, drilling, etching and mask, and a supplier who quotes it without saying so has not priced the build. The published range is on the heavy copper PCB page and the capability page; for the current paths themselves, the industrial control page covers the application.

Technical Specifications

Outer copper limit
20 oz (about 700 µm)
Inner copper limit
10 oz
Board thickness
0.1–6.0 mm
Minimum finished hole
0.15 mm mechanical · 0.1 mm laser
Aspect ratio
15:1

Frequently Asked Questions

  • Can Hitech Circuits produce a 40 oz copper board?

    Not as a standard published build. The process limit is 20 oz on outer layers and 10 oz on inner layers, and the DFM rules, coupons and acceptance checks are written for that range. A request above it is reviewed layer by layer before any commitment, and a copper inlay or a busbar is often the more predictable route.

  • What changes first above the limit?

    Prepreg has to fill a deeper copper step, so resin-rich grades and extra lamination cycles are needed. Drilling consumes more bits, etching takes several passes to keep the top and the bottom of the trace even, and solder mask needs two prints to cover the step. Handling and flatness become limiting factors before the plating bath does.

  • When is a busbar better than more copper?

    When the current is very high, the run is long, or the conductor has to leave the board. Thick copper in the laminate is best for short, wide paths under components; a busbar or copper inlay carries the current where it leaves the board, and the two are usually combined rather than chosen between.

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