Most redesigns are not caused by exotic requirements. They come from five ordinary decisions taken too late.
Hitech Circuits Engineering Desk
Shenzhen, China · PCB fabrication and assembly
2 min read
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Technical review: Process figures checked against our published capability sheet. View capability sheet
Layer count, dielectric and copper weights. It sets impedance and thickness and must be agreed with the fabricator.
Minimum trace, gap and annular ring. Confirm them at the copper weight you actually use.
Copper area, vias and component placement for the power dissipating parts.
Nodes for ICT, pads for flying probe, connectors for functional test.
Fiducials, tooling holes, break-away and clearance for assembly and depanelling.
Because it fixes impedance, thickness and via types before the layout starts. Choosing it later means re-routing rather than adjusting a rule, and every downstream calculation depends on it.
Enough pads or vias for the test method: ICT needs a node at each net, flying probe needs a reachable pad, and functional test needs connectors. Reserved test points cost nothing at layout and a lot after tooling.
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