Passives
Resistors, capacitors and inductors in 01005 to 1210. Size drives stencil aperture, placement accuracy and rework difficulty.
Discrete semiconductors
Diodes and transistors in SOT, SOD and larger power packages. Thermal pads need paste area and via design that matches the datasheet.
Integrated circuits
SOIC, TSSOP, QFN, QFP and BGA. The package sets the footprint, the inspection method and whether X-ray is mandatory.
Connectors and electromechanical
Usually through-hole or press-fit, often the tallest parts on the board. They define clearance for wave solder and for the housing.



