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Electrical Components in PCB Assemblies

Every BOM is a mix of a few families. Knowing their assembly constraints avoids footprints that cannot be built.

Hitech Circuits Engineering Desk

Shenzhen, China · PCB fabrication and assembly

2 min read

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Last updated:

Technical review: Process figures checked against our published capability sheet. View capability sheet

Electrical Components in PCB Assemblies

Passives

Resistors, capacitors and inductors in 01005 to 1210. Size drives stencil aperture, placement accuracy and rework difficulty.

Discrete semiconductors

Diodes and transistors in SOT, SOD and larger power packages. Thermal pads need paste area and via design that matches the datasheet.

Integrated circuits

SOIC, TSSOP, QFN, QFP and BGA. The package sets the footprint, the inspection method and whether X-ray is mandatory.

Connectors and electromechanical

Usually through-hole or press-fit, often the tallest parts on the board. They define clearance for wave solder and for the housing.

Technical Specifications

Small passives
01005 / 0201 placement supported
Assembly
SMT and through-hole, 6,000,000 chips per day
Acceptance
IPC-A-610 workmanship

Frequently Asked Questions

  • What package should a hand-assembled prototype use?

    0603 or 0805 for passives and SOIC where possible. They are large enough to place and rework by hand, while still passing through the same reflow line as the production build.

  • Which packages need the most assembly attention?

    Fine-pitch QFN and BGA: paste volume, placement accuracy and voiding all matter, and inspection needs X-ray. They are buildable, but the stencil and inspection plan should be agreed before the first article.

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